PRODUCT FEATURES Up to 1.25Gb/s bi-directional data links Hot-pluggable SFP footprint Industrial case temperature range (-40°C to +85°C ) Fully metallic enclosure for low EMI Low power dissipation (1.05 W typical) Compact RJ-45 connector assembly Access to physical layer IC via 2-wire serial bus 1000 BASE-T operation in host systems with SERDES interface 1000Mbps compliant in host systems with SGMII interface

PRODUCT FEATURES Up to 1.25Gb/s bi-directional data links Hot-pluggable SFP footprint Industrial case temperature range (-40°C to +85°C ) Fully metallic enclosure for low EMI Low power dissipation (1.05 W typical) Compact RJ-45 connector assembly Access to physical layer IC via 2-wire serial bus 10BASE-T,100BASE-T and 1000 BASE-T operation in host systems with SERDES interface 10/100/1000Mbps compliant in host systems with SGMII interface